Method and metrology apparatus to determine a patterning process parameter

A method, includes illuminating a structure of a metrology target with radiation having a linear polarization in a first direction, receiving radiation redirected from the structure to a polarizing element, wherein the polarizing element has a polarization splitting axis at an angle to the first dir...

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Bibliographic Details
Main Author TARABRIN SERGEY
Format Patent
LanguageChinese
English
Published 24.04.2020
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:A method, includes illuminating a structure of a metrology target with radiation having a linear polarization in a first direction, receiving radiation redirected from the structure to a polarizing element, wherein the polarizing element has a polarization splitting axis at an angle to the first direction, and measuring, using the sensor system, an optical characteristic of the redirected radiation. 一种方法，包括：使用第一方向上具有线性偏振的辐射照射量测目标的结构；接收从该结构重定向到偏振元件的辐射，其中偏振元件具有与第一方向成一定角度的偏振分离轴；以及使用传感器系统测量重定向辐射的光学特性。
Bibliography:Application Number: CN201880058191