THERMOFORMED FILM COMPOSITIONS WITH ENHANCED TOUGHNESS AFTER THERMOFORMING PROCESSES

• Main Authors: PEREZ MUNOZ MARIA LAURA, BUASZCZYK GIANNA, GARGALAKA JUNIOR JOAO, MAZZOLA NICOLAS CARDOSO, HANSEN SYDNEY E, PEREZ CARMELO DECLET
• Format: Patent
• Language: Chinese; English
• Published: 21.04.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

Embodiments of thermoformed monolayer or multilayer films are provided, wherein the thermoformed monolayer multilayer films comprise a first composition comprising at least one ethylene-based polymer,wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I /I2) that meets the following equation: I /I2>= 7.0 - 1.2 x log (I2). 提供了热成型单层或多层膜的实施方案，其中热成型单层或多层膜包含第一组合物，第一组合物包括至少一种乙烯类聚合物，其中所述第一组合物包括大于0.9的分子加权共聚单体分布指数(MWCDI)值，和满足以下等式的熔体指数比(I/I)：I/I≥7.0-1.2x log(I)。