Micron-sized pore deslagging method for epoxy substrate

The invention relates to a micron-sized pore deslagging method for an epoxy substrate. The method comprises a first deslagging liquid and a second deslagging liquid, and specifically comprises the following deslagging steps: step 1, putting an epoxy substrate after drilling into the first deslagging...

Full description

Saved in:
Bibliographic Details
Main Authors SHU ZHIHUA, MENG YONGLI, ZHAN YOUGEN, ZHAN SIHAN, PAN QING
Format Patent
LanguageChinese
English
Published 21.04.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:The invention relates to a micron-sized pore deslagging method for an epoxy substrate. The method comprises a first deslagging liquid and a second deslagging liquid, and specifically comprises the following deslagging steps: step 1, putting an epoxy substrate after drilling into the first deslagging liquid (submerging the epoxy substrate), carrying out ultrasonic assistance for 5-10 minutes, controlling the ultrasonic frequency to be 40 kHz and the power to be 100-200 W, and intermittently working for 15-30 seconds; after the ultrasonic treatment is finished, taking out the epoxy substrate, cleaning the surface of the epoxy substrate by using an elastic scraper or an air gun, and standing for 30 minutes; step 2, placing the epoxy substrate treated in the first step in a container with an air suction hood, spraying the second deslagging liquid till the epoxy substrate is submerged, performing ultrasonic assistance for 5-10 min, controlling the ultrasonic frequency to be 80-120 kHz and the power to be 100-200 W
Bibliography:Application Number: CN201911355680