Circuit board, equipment and via hole forming method

• Main Authors: YI BI, WANG YINGXIN, CAO HUAZHANG, YIN CHANGGANG
• Format: Patent
• Language: Chinese; English
• Published: 14.04.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The embodiment of the invention provides a circuit board, equipment and a via hole forming method. A via hole structure formed on a circuit board main body (10) of the circuit board comprises a hole (12) formed by enclosing a conductive layer in the circuit board main body (10), the conductive layer forms a hole wall (11) of the hole (12), a dielectric filling layer (13) of which the dielectric constant is smaller than that of the circuit board main body (10) is arranged between at least part of the hole wall (11) of the hole (12) and the circuit board main body (10), that is to say, in some implementation processes, the dielectric constant of a medium around the via hole is smaller than the dielectric constant of the circuit board main body (10), so that the parasitic capacitance of the via hole is reduced, the impedance of the via hole is improved to be closer to the impedance of a transmission line, and the impedance continuity of a system link is effectively improved. 本发明实施例提供一种电路板、设备及过孔形成方法，在电路板的电路板主体(10