Low-temperature reliability evaluation method for lead-free component interconnection welding spots

• Main Authors: LYU QIANQIAN, GU HANTIAN, WANG YANG, GU CHONGYANG
• Format: Patent
• Language: Chinese; English
• Published: 10.04.2020
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention provides alow-temperature reliability evaluation method for lead-free component interconnection welding spots. The evaluation method comprises: designing and manufacturing a lead-free solder low-temperature test sample piece; implementing a lead-free solder low-temperature mechanical property test; analyzing the low-temperature mechanical property of the lead-free solder; and carrying out reliability evaluation on the lead-free solder under the low-temperature condition. According to the method, the problem of material characteristic change caused by ductile-brittle transition possibly occurring to the lead-free electronic component under the low-temperature use condition is considered, and the steps of conducting a lead-free solder mechanical characteristic test under the low-temperature condition and the method for evaluating the reliability of the lead-free solder mechanical characteristic test are given. Compared with a traditional lead-free solder reliability evaluation method, the method h