RESIN COMPOSITION, PHOTOSENSITIVE FILM, PHOTOSENSITIVE FILM WITH SUPPORT, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

• Main Author: KARAGAWA SHIKO
• Format: Patent
• Language: Chinese; English
• Published: 03.04.2020
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS

The present invention addresses the problem of providing a photosensitive resin composition or the like with which it is possible to obtain a cured product having excellent lateral erosion resistance.The invention provides a resin composition containing (A) a resin containing an alkenyl unsaturated group and a carboxyl group, (B) an inorganic filler having an average particle diameter of 0.5 [mu]m or more, (C) an epoxy resin, and (D) a photopolymerization initiator, wherein the component (A) contains (A-1) a resin containing a naphthalene skeleton. 本发明的课题是提供可得到抗侧蚀性优异的固化物的感光性树脂组合物等。本发明的解决手段是一种树脂组合物，其是含有(A)包含烯属不饱和基团和羧基的树脂、(B)平均粒径为0.5μm以上的无机填充材料、(C)环氧树脂和(D)光聚合引发剂的树脂组合物，其中，(A)成分包含(A-1)含有萘骨架的树脂。