ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

An electronic package and a manufacturing method thereof. An electronic component, having a sensing area, and a conductive structure are embedded in an insulator, wherein the sensing area is exposed of the insulator. The electronic component and the conductive structure are electrically connected th...

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Bibliographic Details
Main Author HO CHI CHING
Format Patent
LanguageChinese
English
Published 03.04.2020
Subjects
CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
TRANSPORTING
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Summary:An electronic package and a manufacturing method thereof. An electronic component, having a sensing area, and a conductive structure are embedded in an insulator, wherein the sensing area is exposed of the insulator. The electronic component and the conductive structure are electrically connected through a line structure; then a trench of a board is configured to the sensing area of the electroniccomponent. 一种电子封装件及其制法，将具有感测区的电子元件与导电结构埋设于绝缘体中，且令该感测区外露出该绝缘体，并以线路结构电性连接该电子元件与该导电结构，再将一板体的沟槽配置于该电子元件的感测区上。
Bibliography:Application Number: CN201811229518