Heat dissipation device for wireless access point

• Main Authors: REN WENJUN, GAO HUACHEN, WEN PING
• Format: Patent
• Language: Chinese; English
• Published: 27.03.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SELECTING

The invention provides a heat dissipation device for a wireless access point. The heat dissipation device comprises a shell, a rectangular hollow radiator, a power supply PCBA circuit board, a WIFI module PCBA circuit board, radiating fins and a heat absorption block, wherein the power supply PCBA circuit board is arranged in the rectangular hollow radiator. The WIFI module PCBA circuit board is arranged on the rectangular hollow radiator. The radiating fin is arranged on the WIFI module PCBA circuit board, the heat absorption block is arranged between the shell and the radiating fin, and therectangular hollow radiator, the power supply PCBA circuit board, the WIFI module PCBA circuit board, the radiating fin and the heat absorption block are all arranged in the shell. The temperature onthe PCBA circuit board of the WIFI module is conducted to the rectangular hollow radiator to be dissipated to the four sides, a large amount of internal space is saved, heat of the cooling fins is separated from the shell thro