Package and electronic device

• Main Authors: OOKA YUTAKA, MIYAZAWA SHINJI, HIRANO TAKAAKI, MAEDA KENSAKU, MORIYA YUSUKE, FURUSE SHUNSUKE
• Format: Patent
• Language: Chinese; English
• Published: 27.03.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a package and an electronic device. The package includes: a support substrate; a wiring layer on the support substrate; a semiconductor substrate on the wiring layer; an effective photosensitive region including an optical element in the semiconductor substrate and including a lens; an effective photosensitive region peripheral region; an end portion between an outer edgeof the package and a peripheral region of the effective photosensitive region; and a structure having the same strength as the lens per unit area, the structure being provided at a part of the outer side of the effective photosensitive region where the optical element is formed when the semiconductor substrate is viewed in plan view. The present invention can implement control so that lens deformation does not occur. 本发明涉及一种封装和电子装置。所述封装包括：支撑基板；配线层，在所述支撑基板上；半导体基板，在所述配线层上；有效感光区域，包括在所述半导体基板中的光学元件并且包括透镜；有效感光区域外围区域；端部，位于所述封装的外缘和所述有效感光区域外围区域之间；以及具有与所述透镜的每单位面积强度相同的强度的结构，当俯视观察所述半导体基板时，所述结构设置在形成有所述光学元件的所述有效感光区域的外侧的一部分处。本发明能够实施