Laser processing apparatus

• Main Authors: HAN SANGSUN, LEE SEOKJOO, BAEK JINWON, HONG KYONGHO
• Format: Patent
• Language: Chinese; English
• Published: 27.03.2020
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention relates to a laser processing apparatus. The laser processing apparatus includes: a laser light source configured to emit a laser beam; an optical scanner located along a path of the laser beam and configured to adjust the path of the laser beam; a lens unit located along the path of the laser beam, the lens unit being configured to condense the laser beam; a first adapter located between the lens unit and the optical scanner and coupled to the lens unit; and a second adapter located between the first adapter and the optical scanner, the second adapter being coupled to the firstadapter and the optical scanner. 本公开涉及一种激光处理设备，所述激光处理设备包括：激光源，所述激光源被配置为发射激光束；光学扫描器，所述光学扫描器沿着所述激光束的路径定位并且被配置为调节所述激光束的所述路径；透镜单元，所述透镜单元沿着所述激光束的所述路径定位，所述透镜单元被配置为聚集所述激光束；第一适配器，所述第一适配器位于所述透镜单元和所述光学扫描器之间并且耦接到所述透镜单元；以及第二适配器，所述第二适配器位于所述第一适配器和所述光学扫描器之间，所述第二适配器耦接到所述第一适配器和所述光学扫描器。