Sucker for transferring and fixing LED chips in batches by transferring wafers and method

• Main Authors: LIN JUNYAO, JIANG ZONGHAN, HUANG SHIKAI, HUANG ZHAOMING, HONG XIULING
• Format: Patent
• Language: Chinese; English
• Published: 24.03.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a sucker for transferring and fixing LED chips in batches by transferring wafers and a using method of the sucker. The sucker is an electrostatic sucking disc, and comprises aflat adsorption area and an electrostatic circuit arranged in the flat adsorption area, the whole wafer is directly transferred through the flat adsorption area with the electrostatic circuit; according to the LED chips needed on the back plate, the corresponding LED chips on the wafer are selectively separated and transferred to the back plate, the sucker is mainly used for LED chip batch transfer so as to improve the yield of LED chip transferred to the back plate, and the sucker is simple in structure and easy and convenient to use. 本发明公开了一种通过转移晶圆批量转移、固定LED芯片的吸盘及其使用方法，所述的吸盘为静电吸盘，包括：平坦吸附区、及设置平坦吸附区的静电电路，通过带有静电电路的平坦吸附区直接把整块晶圆转移，根据背板上所需要LED芯片，选择性使晶圆上对应的LED芯片脱离转移至背板，本发明主要用于LED芯片批量转移，以此来提高LED芯片向背板转移的良率，本产品结构简单，使用方法简便。