Electronic device and manufacturing method thereof

An electronic device comprises a circuit board and an electronic element. The circuit board comprises a board body and a plurality of through holes penetrating through the board body. Each through hole has a first diameter. The electronic component comprises a plurality of pins, each pin has a secon...

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Bibliographic Details
Main Authors LIANG JINGMIN, TAN JIANGANG
Format Patent
LanguageChinese
English
Published 10.03.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An electronic device comprises a circuit board and an electronic element. The circuit board comprises a board body and a plurality of through holes penetrating through the board body. Each through hole has a first diameter. The electronic component comprises a plurality of pins, each pin has a second diameter, the second diameter is smaller than the first diameter, the diameter difference ranges from 0.4 mm to 0.6 mm, and the pins penetrate through the corresponding through holes respectively and are fixed to the circuit board in a welded mode. 一种电子装置包含电路板，及电子元件。所述电路板包括板体及多个贯穿所述板体的通孔。每一通孔具有第一直径。所述电子元件包括多个引脚，每一引脚具有第二直径，所述第二直径小于所述第一直径且直径差介于0.4毫米到0.6毫米，所述引脚分别穿入对应的通孔并以焊接方式与所述电路板固定。
Bibliography:Application Number: CN201811019522