ELECTRONIC DEVICE AND METHOD FOR DETERMINING CAUSE OF MOUNTING DEFECT IN COMPONENTS MOUNTED ON SUBSTRATE

• Main Authors: CHOI SU HYEONG, LEE DUK YOUNG, LEE JONG MYOUNG, JEONG HYEON SU
• Format: Patent
• Language: Chinese; English
• Published: 06.03.2020
• Subjects: ACCESSORIES THEREFOR; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PHOTOGRAPHY; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; PRINTED CIRCUITS

A method, for determining the cause of mounting defect in each of a plurality of components mounted on a substrate, which is performed by an electronic device can comprise the steps of: receiving a test result, with respect to whether or not each of a plurality of first components has mounting defect, which is determined by means of a test for a plurality of first-type substrates on which the plurality of first components are mounted; calculating the respective mounting defect rates of the plurality of first components by means of the test result; determining a plurality of second components in which mounting defect has occurred among the plurality of first components on the basis of the respective mounting defect rates of the plurality of first components; and determining the cause of mounting defect of each of the plurality of second components as at least one of a mounting position setting error of a component, a mounting condition setting error in accordance with a component type,and the defect of a nozzl