Method for evalluting heat sensitive structures

• Main Authors: LIU SZU-LIN, KUNDU AMIT, LIU SHENG-FENG, CHANG CHUN-WEI, YU TSENG HSIEN
• Format: Patent
• Language: Chinese; English
• Published: 03.03.2020
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

The invention discloses a method for evaluating heat sensitive structures, and reveals an electromigration (EM) verification method. The method analyzes an integrated circuit design layout to identifyheat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM verification method includes the steps: adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling range. 一种评估热敏结构的方法。揭露了一种电迁移(EM：electromigration)验证方法，该电迁移验证方法分析集成电路设计布局以识别热敏结构、自我加热效应、发热结构和散热结构。该EM验证方法包括通过以下方式来对热敏结构的评估温度进行调节：计算温度敏感结构内的自我加热效应，以及作为与位于限定的热耦合范围内的周围发热结构和/或散热元件的热耦合的函数的额外加热和/或冷却。