Semiconductor memory device, semiconductor memory module, and method of accessing nonvolatile memory

A semiconductor memory device may include banks. A sensor is disposed adjacent to the banks and configured to sense a temperature. An address buffer is configured to receive an address from an external device. A first demultiplexer is configured to transfer a row address in the address to one of the...

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Bibliographic Details
Main Authors JUNG JIWAN, LEE TAESUNG, KAVALA ANIL, IHM JEONGDON
Format Patent
LanguageChinese
English
Published 28.02.2020
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Summary:A semiconductor memory device may include banks. A sensor is disposed adjacent to the banks and configured to sense a temperature. An address buffer is configured to receive an address from an external device. A first demultiplexer is configured to transfer a row address in the address to one of the banks. A second demultiplexer is configured to transfer a column address in the address to one of the banks. A command buffer is configured to receive a command from the external device. A control logic block is configured to control the first and second demultiplexers and the banks in accordance with the command and bank information in the address. A data buffer is configured to exchange data signals between the banks and the external device. The control logic block may be further configured to transfer information on the temperature to the external device. 一种半导体存储设备可以包括存储体。传感器被布置为与存储体相邻并且被配置为感测温度。地址缓冲器被配置为从外部设备接收地址。第一解复用器被配置为向存储体之一传递地址中的行地址。第二解复用器被配置为向存储体之一传递地址中的列地址。命令缓冲器被配置为从外部设备接收命令。控制逻辑块被配置为根据命令和地址中的存储体信息来控制第
Bibliography:Application Number: CN201910767638