Printed circuit board and semiconductor package including the same

• Main Author: JANG KEUN HO
• Format: Patent
• Language: Chinese; English
• Published: 21.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention discloses a printed circuit board and a semiconductor package including the same. The semiconductor package including a package substrate including a mounting region and at least one through-hole arranged in the mounting region, and a semiconductor chip mounted on the mounting region, the semiconductor chip including a first side and a second side, the second side of the semiconductor chip being opposite to the first side of the semiconductor chip, the at least one through-hole of the package substrate being closer to the second side of the semiconductor chip than the first sideof the semiconductor chip may be provided. 本申请公开了印刷电路板和包括该印刷电路板的半导体封装件。一种半导体封装件，其包括封装衬底，所述封装衬底包括安装区域和布置在所述安装区域中的至少一个通孔，以及安装在所述安装区域上的半导体芯片，所述半导体芯片包括第一侧和第二侧，所述半导体芯片的所述第二侧与所述半导体芯片的所述第一侧相对，可提供所述封装衬底的所述至少一个通孔，所述至少一个通孔到所述半导体芯片的所述第二侧的距离小于所述至少一个通孔到所述半导体芯片的所述第一侧的距离。