Semi-automatic wafer discharging device based on wax-free polishing process

• Main Authors: LI XIAOYAN, ZHANG CHUN, JIA JIE, SUN CHENGUANG, LI JIANLE, WANG YANJUN, CHEN ZHENYU
• Format: Patent
• Language: Chinese; English
• Published: 21.02.2020
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention provides a semi-automatic wafer discharging device based on the wax-free polishing process. The semi-automatic wafer discharging device comprises a tool shell and a lifting bracket. Oneside of the tool shell is provided with a vertical strip-shaped hole. An electric cylinder and linear guide rails are vertically mounted in the position, on the outer side of the strip-shaped hole, ofthe tool shell. The driving end of the lifting bracket is connected with the electric cylinder and is clamped to the linear guide rails. The lifting bracket is connected with the front end of a jacking plate through a first cylinder. The lifting bracket is rotatably connected with the rear end of the jacking plate. Gear shaping plates are mounted on the jacking plate. Electric cylinder sliding tables are arranged on the gear shaping plates. The electric cylinder sliding tables are connected with a gear shaping device. The upper portion of the jacking plate is connected with a tray through a second cylinder. A center d