ETCHANT COMPOSITION AND METHOD OF MANUFACTURING WIRING SUBSTRATE USING THE SAME

• Main Authors: YOON YOUNG JIN, KUK IN SEOL, LEE DONG HEE, KIM SEUNG HEE, KIM SANG TAE, KIM JIN SUEK, LIM DAE SUNG, SHIM SEUNG BO, KIM BEOM SOO, KIM BONG KYUN, CHOI SHIN HYUK, PARK YOUNG CHUL
• Format: Patent
• Language: Chinese; English
• Published: 04.02.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PRINTED CIRCUITS

The invention relates to an etchant composition and a method of manufacturing a wiring substrate using the same. The etchant composition may include: a peroxosulfate; a cyclic amine compound; a firstamphoteric compound including a carboxyl group; and a second amphoteric compound including a sulfone group, wherein the second amphoteric compound may be different from the first amphoteric compound. 本发明涉及蚀刻剂组合物以及制造布线基板的方法。蚀刻剂组合物可包括：过氧硫酸盐、环胺化合物、包括羧基的第一两性化合物和包括砜基的第二两性化合物，其中第二两性化合物可不同于第一两性化合物。