PCB heat dissipation assembly and server with same

The invention discloses a PCB heat dissipation assembly and a server with the same. The PCB heat dissipation assembly comprises a PCB and a heat dissipation device; one side surface of the PCB is provided with at least two chips subjected to series power supply; the heat dissipation device comprises...

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Bibliographic Details
Main Author HU HANGKONG
Format Patent
LanguageChinese
English
Published 24.01.2020
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:The invention discloses a PCB heat dissipation assembly and a server with the same. The PCB heat dissipation assembly comprises a PCB and a heat dissipation device; one side surface of the PCB is provided with at least two chips subjected to series power supply; the heat dissipation device comprises a heat conduction plate and flat pipes; the first surface of the heat conduction plate is attachedto the surfaces of the at least two chips; containing groove parts are formed in the second surface of the heat conduction plate; the containing groove parts are opposite to the chips; and the surfaceof one side of each flat pipe makes contact with the bottom wall of the interior of the corresponding containing groove part. According to the PCB heat dissipation assembly, the heat conduction platecan separate the PCB from the flat pipes, so that the phenomenon that the flat pipes deform towards the chips to damage the chips when the pressure of a liquid cooling medium entering the flat pipesis too large under the condi
Bibliography:Application Number: CN201910912667