SEALING FILM

The present application relates to a sealing film, a method for preparing same, an organic electronic device comprising same and a method for preparing an organic electronic device using same. Provided is a sealing film which enables forming of a structure blocking moisture or oxygen from flowing in...

Full description

Saved in:
Bibliographic Details
Main Authors SHIN SE HO, SHIN MOON CHEOL, JEONG WHOON, RYU JAE SEOL, RYU DONG HWAN, YOO HO JOON
Format Patent
LanguageChinese
English
Published 17.01.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:The present application relates to a sealing film, a method for preparing same, an organic electronic device comprising same and a method for preparing an organic electronic device using same. Provided is a sealing film which enables forming of a structure blocking moisture or oxygen from flowing into an organic electronic device from outside, effective emission of heat accumulates inside the organic electronic device, and prevention of bright spots generated on the organic electronic device. 本申请涉及封装膜、用于制造其的方法、包括其的有机电子器件、以及用于使用其制备有机电子器件的方法，所述封装膜允许形成能够阻挡水分或氧从外部引入有机电子器件中的结构，并且可以有效地释放有机电子器件内部积聚的热，并且防止有机电子器件出现亮点。
Bibliography:Application Number: CN201880037678