Thermal leadless array package with die attach pad locking feature

• Main Authors: SERAFIN PEDRON JR, ALBERT LOH, SARAVUTH SITINORAKUL, EDWARD THEN
• Format: Patent
• Language: Chinese; English
• Published: 14.01.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability.In some embodiments, the contacts include four active corner contacts. 本发明的实施例是针对于一种具有裸片附接焊盘锁定特征的热无引线阵列封装及其制造方法。对铜层的两个表面进行半蚀刻以界定封装接触阵列和裸片附接焊盘。为了实现更佳的可靠性，将每个裸片附接焊盘完全嵌入密封材料以提供良好的机械锁定特征。在一些实施例中，所述接触包括四个有源拐角接触。