Cleaning method

A cleaning method includes providing a circuit substrate on which an IC is soldered; providing an atmospheric plasma generating device; introducing a gas into the atmospheric plasma generating device,activating the gas by using the atmospheric plasma generating device to form a plasma, and allowing...

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Bibliographic Details
Main Authors WU CHIN-JYI, CHEN YUH-FENG
Format Patent
LanguageChinese
English
Published 07.01.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLEANING
CLEANING IN GENERAL
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
PRINTED CIRCUITS
TRANSPORTING
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Summary:A cleaning method includes providing a circuit substrate on which an IC is soldered; providing an atmospheric plasma generating device; introducing a gas into the atmospheric plasma generating device,activating the gas by using the atmospheric plasma generating device to form a plasma, and allowing the atmospheric plasma generating device to eject the plasma at a wind speed of about 100 to about300 m/s (m/s); and cleaning the surface of the circuit substrate on which the IC is soldered by using the sprayed plasma so as to achieve excellent pollutant removal capability. 一种清洁方法，包含提供已焊上IC的电路基板；提供大气电浆产生装置；导入气体至大气电浆产生装置中，并利用大气电浆产生装置活化气体以形成电浆，且让大气电浆产生装置以约100至约300米/秒(m/s)的风速喷出电浆；以及利用喷出的电浆清洁已焊上IC的电路基板的表面，以达成具有极佳移除污染物的能力。
Bibliography:Application Number: CN201910476288