Heat dissipation device, semiconductor packaging system and method of manufacturing thereof

The invention discloses a heat dissipation device (100) that includes a first part (104) having a first material and a surface portion (108); and a second part (110) on the surface portion. The secondpart has a second material and a porosity. 本发明公开了一种散热器件(100)，其包括：包括第一材料并且具有表面部分(108)的第一部分(104)；以及处于所...

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Bibliographic Details
Main Authors JUERSS MICHAEL, OTREMBA RALF, ESCHER-POEPPEL IRMGARD, SCHARF THORSTEN, GRUBER MARTIN
Format Patent
LanguageChinese
English
Published 03.01.2020
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The invention discloses a heat dissipation device (100) that includes a first part (104) having a first material and a surface portion (108); and a second part (110) on the surface portion. The secondpart has a second material and a porosity. 本发明公开了一种散热器件(100)，其包括：包括第一材料并且具有表面部分(108)的第一部分(104)；以及处于所述表面部分上的第二部分(110)，所述第二部分包括第二材料；所述第二部分(110)具有孔隙度。
Bibliography:Application Number: CN201910569814