Enameled wire laser peeling method and device for connector

• Main Author: ZHU BINGWEN
• Format: Patent
• Language: Chinese; English
• Published: 24.12.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; CURRENT COLLECTORS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRICITY; GENERATION; INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES; LINE CONNECTORS; MACHINE TOOLS; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PUNCHING METAL; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING OR PROCESSING OF METAL WIRE

The invention provides an enameled wire laser peeling method and device for a connector. The enameled wire laser peeling device of the connector comprises a box body, a bottom of an inner wall of thebox body is fixedly connected with a base, laser transmitters are arranged on two sides of a back surface of the inner wall of the box body, a bottom plate is arranged at a side of the base facing thebox body, a feeding conveying belt is fixedly connected to a left side of a top of the bottom plate, a material distribution rail is fixedly connected to the left side of the top of the bottom plateand is located on a right side of the feeding conveying belt, and a material stirring rail is fixedly connected to the top of the bottom plate. According to the enameled wire laser peeling method anddevice for the connector provided by the invention, a supporting plate at the material stirring rail can increase the size of a placing area at one end of the feeding conveying belt, a coil can be conveniently placed on the feed