A semiconductor light emitting element

A semiconductor light emitting element includes a bonding substrate, the bonding substrate of the semiconductor light emitting element including a first surface and a second surface, a plurality of metal layers on the first surface, a semiconductor light emitting sequence on the plurality of metal l...

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Bibliographic Details
Main Authors WU JUNYI, KE WEIFAN, ZHONG BINGXIAN
Format Patent
LanguageChinese
English
Published 13.12.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor light emitting element includes a bonding substrate, the bonding substrate of the semiconductor light emitting element including a first surface and a second surface, a plurality of metal layers on the first surface, a semiconductor light emitting sequence on the plurality of metal layers, and an edge of the bonding substrate forming a stepped structure such that an edge portion ofthe first surface of the bonding substrate is uncovered. 一种半导体发光元件，其包括键合衬底，该半导体发光元件的键合衬底包括第一表面和第二表面，第一表面上的多层金属层，多层金属层上的半导体发光序列，该键合衬底的边缘形成台阶结构，以使键合衬底的第一表面的边缘部分未被覆盖。
Bibliography:Application Number: CN201880025748