Method and device for preparing large-area and high-depth-to-width-ratio flexible micro-nano functional structure through vacuum pressure forming

• Main Authors: LI CHENHUI, YUAN WEIZHENG, HE YANG, YANG RUYUAN, ZHANG KAIXUAN, MOU ZHENLIN, ZHOU ZIDAN, LYU XIANGLIAN, WANG SHENGKUN
• Format: Patent
• Language: Chinese; English
• Published: 13.12.2019
• Subjects: MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

The invention discloses a method and a device for preparing a large-area and high-aspect-ratio flexible micro-nano functional structure through vacuum pressure forming, and belongs to the field of micro-nano machining. The device mainly comprises a closed cavity which is composed of an upper shell 1 and a lower shell 3 and has air tightness. The cavity is divided into an upper part and a lower part by a thin film 8 to be imprinted; the part defined by the upper side of the thin film, the upper shell 1 and the pore plate 2 is an upper cavity 12; and the part defined by the lower side of the thin film and the lower shell 3 is a lower cavity 11; a mold layer 5 is arranged at the bottom of the lower chamber 11, and a mother set of a to-be-embossed pattern is provided on the upper surface of the mold 5; a pore plate layer 2 parallel to the film layer 8 is arranged in the upper chamber 12; the upper cavity 12 and the lower cavity 11 are both communicated with an airflow control device 10, and the airflow control de