Preparation method of electronic silicon carbide chip

• Main Author: DI ZHIYU
• Format: Patent
• Language: Chinese; English
• Published: 10.12.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention belongs to the field of silicon carbide chip processing, and particularly relates to a preparation method of an electronic silicon carbide chip. Aiming at the problem that the pouring amount of epoxy resin is inconvenient to accurately control in the prior art, the invention provides a scheme that the method comprises the following steps: S1, inputting size data of a silicon carbidechip to be prepared into a computer, performing modeling on the computer, and determining the size of a mold according to the size of the silicon carbide chip; S2, establishing a mold model on the computer, putting a silicon carbide circuit board into the mold model in a simulated manner, and positioning the silicon carbide circuit board; S3, pouring epoxy resin into the mold model in a simulatedmanner, and recording the data of the pouring amount; and S4, putting a silicon carbide circuit board into an actual mold, and pouring epoxy resin into the mold for molding according to the pouring amount in S3. The pouring am