Multilayer ceramic capacitor
The invention relates to a multilayer ceramic capacitor that includes: a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and each of the internal electrode layers is alternate...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
10.12.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a multilayer ceramic capacitor that includes: a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces of the multilayer chip, a main component of the plurality of dielectriclayers being a ceramic; and a pair of external electrodes that are formed on the two end faces; wherein: the pair of external electrodes have a structure in which a plated layer is formed on a groundlayer; a main component of the ground layer is a metal or an alloy including at least one of Ni and Cu; and at least a part of a surface of the ground layer on a side of the plated layer includes an interposing substance including Mo.
本发明涉及一种层叠陶瓷电容器,包括:具有平行六面体形状的层叠芯片,其中多个电介质层中的每一层和多个内部电极层中的每一层交替地层叠,并且该多个内部电极层的每一层交替地露出至层叠芯片的两个端面,该多个电介质层的主要成分是陶瓷;以及形成在两个端面上的一对外部电极;其中:该一对外部电极具有在底层上形成镀层的结构;底层的主要成分是包含Ni和Cu中的至少一种的金属或合金;并且,底层的镀层侧表 |
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Bibliography: | Application Number: CN201910461518 |