Capsule shell material, microcapsule active agent for soldering, preparing methods of capsule shell material and microcapsule active agent, solder paste and application of microcapsule active agent and solder paste

• Main Authors: WU JIAQIAN, PAN KAIHUA, SUN FULIN, XIE PENG, LIN YUANHUA, ZHANG YUHANG, DAI XIANBIN
• Format: Patent
• Language: Chinese; English
• Published: 10.12.2019
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention relates to the technical field of soldering active agents, and discloses a capsule shell material, a microcapsule active agent for soldering, preparing methods of the capsule shell material and the microcapsule active agent, solder paste and application of the solder paste. The preparing method of the capsule shell material includes the steps of heating an organic polymer monomer to200-280 DEG C, and then conducting cooling and recrystallizing, wherein the organic polymer monomer is at least one of palustric acid, maleic anhydride, acrylic resin, butyne dicarboxylic acid, methylacrylate, trimellitate and glycerin monostearate. The capsule shell material is prepared through the preparing method. The preparing method of the microcapsule active agent for soldering includes thestep of conducting interface polymerization reaction on the capsule shell material to wrap an organic acid active agent core material to form a microcapsule. The microcapsule active agent for soldering prepared through the pre