THERMOELECTRIC HEAT PUMP CASCADE USING MULTIPLE PRINTED CIRCUIT BOARDS WITH THERMOELECTRIC MODULES

• Main Authors: WILLIAMS BRIAN J, SCHNEIDER KEVIN S, REED JASON D, YADAV ABHISHEK, NEWMAN DEVON, EDWARDS JESSE W
• Format: Patent
• Language: Chinese; English
• Published: 06.12.2019
• Subjects: BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMBINED HEATING AND REFRIGERATION SYSTEMS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT PUMP SYSTEMS; HEATING; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; PRINTED CIRCUITS; REFRIGERATION MACHINES, PLANTS OR SYSTEMS; REFRIGERATION OR COOLING; WEAPONS

A thermoelectric heat pump cascade and a method of manufacturing such are disclosed herein. In some embodiments, a thermoelectric heat pump cascade includes a first stage plurality of thermoelectric devices attached to a first stage circuit board and a first stage thermal interface material between the thermoelectric devices and the heat spreading lid over the thermoelectric devices. The thermoelectric heat pump cascade component also includes a second stage plurality of thermoelectric devices attached to a second stage circuit board where the second stage plurality of thermoelectric devices has a greater heat pumping capacity than the first stage plurality of thermoelectric devices, and a second stage thermal interface material between the second stage plurality of thermoelectric devicesand the first stage plurality of thermoelectric devices. In this way, a greater temperature difference can be achieved while allowing for protection of the thermoelectric devices, simplifying design,and improving reliability