Photosensitive solder resist material with short exposure time and preparation method thereof

• Main Authors: ZHOU RUIBO, ZHONG YUANBO, XIE RUIFANG
• Format: Patent
• Language: Chinese; English
• Published: 06.12.2019
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INKS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; USE OF MATERIALS THEREFOR; WOODSTAINS

The invention discloses a photosensitive solder resist material with short exposure time. The photosensitive solder resist material comprises the following components in parts by weight: 35-40 parts of photosensitive resin, 5-10 parts of polyurethane acrylate, 5-10 parts of acrylic acid monomers, 4-8 parts of epoxy resin, 1-4 parts of a pigment, 25-35 parts of a filler, 5-10 parts of a photoinitiator, 1-5 parts of an auxiliary agent and 3-8 parts of a solvent. Photosensitive resin is obtained by carrying out a polymerization reaction on acrylic acid and o-cresol formaldehyde epoxy resin, and then sequentially reacting a reaction product with anhydride and glycidyl methacrylate. The exposure time of the prepared photosensitive solder resist material is short, and is only 5-10 seconds, and the exposure time of traditional ink is generally about 20-25 seconds, so that the exposure time is shortened by 1-5 times compared with the traditional exposure time; the photosensitive solder resistmaterial also has the adv