Lens module and forming method

• Main Authors: LI SHAOZHI, QIU AIGANG
• Format: Patent
• Language: Chinese; English
• Published: 03.12.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a lens module and a forming method. The lens module comprises a first lens, a substrate, a side wall, an image sensor and a protective layer. A first extinction layer is formedon a surface of a non-optical area of the first lens, and a second extinction layer is formed on a side wall surface of the side wall so that reflection and formation of stray light are reduced, the stray light is effectively prevented from entering the image sensor, and imaging quality of the lens module is improved. In the forming method of the lens module, an image sensor wafer, a side wall wafer and a first lens wafer which are bonded in sequence are wafer-level optical elements (WLO), a wafer-level manufacturing technology and process are adopted, batch copying and processing can be conducted through a semiconductor process, then a single lens module is formed through cutting, a size is small, cost is low, and advantages of large-scale production of the semiconductor process can be used. Optical element integ