Carrier film and method for manufacturing electronic component

• Main Authors: YAMAMOTO ISSEI, ASAI RYOTA
• Format: Patent
• Language: Chinese; English
• Published: 29.11.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG, OR MIXTURESCONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE

Provided are a carrier film in which, when at least one of a through-hole and a bottomed hole is formed by means of an ultraviolet laser in a sheet member molded on the carrier film, excessive processing in the vicinity of an interface therebetween is suppressed, and a method for manufacturing an electronic component using the carrier film. The carrier film (10) is used for molding a sheet member(20) and, when irradiated with ultraviolet laser (B) with a wavelength distribution having a central wavelength of from 355 nm to 365 nm and including a wavelength of 375 nm or more, has an absorptionrate of not less than 50% with respect to components of less than 375 nm in the wavelength distribution of the ultraviolet laser (B) and an absorption rate of less than 50% with respect to componentsof not less than 375 nm. 本发明提供当通过紫外线激光在成形于载体膜上的片材构件上形成作为贯通孔和盲孔中至少一种的孔时可抑制两者的界面附近处的过度的加工的载体膜和使用它的电子零件的制造方法。载体膜(10)用于片材构件(20)的成形，当被照射具有中心波长为355nm～365nm并包含375nm以上波长的波长分布的紫外线激光(B)时，载体膜(10)中，紫外线激光(B)的波长分布中的不足375nm的成分的吸收率为50％以上，紫外线激