Device and method for cutting semiconductor materials

The invention belongs to the field of semiconductors, in particular to a device and a method for cutting semiconductor materials. In order to solve the problems that by adopting an existing device forcutting semiconductor thermoelectric materials, the automation degree is lower, equipment cannot be...

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Bibliographic Details
Main Author DI ZHIYU
Format Patent
LanguageChinese
English
Published 26.11.2019
Subjects
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:The invention belongs to the field of semiconductors, in particular to a device and a method for cutting semiconductor materials. In order to solve the problems that by adopting an existing device forcutting semiconductor thermoelectric materials, the automation degree is lower, equipment cannot be adjusted conveniently based on needs so as not to cut out semiconductor thermoelectric materials with different lengths, and the existing device is inconvenient to operate, the device for cutting the semiconductor materials disclosed by the invention is provided. The device for cutting the semiconductor materials comprises a base, wherein a U-shaped frame is fixedly mounted on the top of the base; a connector is arranged on one side of the U-shaped frame; an air cylinder is fixedly mounted on the top inner wall of the connector; and the inner wall of one side of the connector is connected with a connecting cover in a sliding manner. According to the device for cutting the semiconductor materials disclosed by the in
Bibliography:Application Number: CN201910801890