Knife side nozzle component, knife blade cooling device and dicing saw

The invention relates to the technical field of wafer processing equipment, in particular to a knife side nozzle component, a knife blade cooling device and a dicing saw. The dicing saw comprises a rack, an air static pressure high-speed spindle and the knife blade cooling device, wherein the knife...

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Bibliographic Details
Main Authors LAN JIAN, SUN YAHUI, ZHAO TONGYU, CHEN ZHIHUI, WU ZHENBO
Format Patent
LanguageChinese
English
Published 26.11.2019
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Summary:The invention relates to the technical field of wafer processing equipment, in particular to a knife side nozzle component, a knife blade cooling device and a dicing saw. The dicing saw comprises a rack, an air static pressure high-speed spindle and the knife blade cooling device, wherein the knife blade cooling device is installed on one end of the spindle for installing the knife blade; the knife blade cooling device comprises a fixed base, a blade main cooling nozzle and a blade side nozzle component; the blade main cooling nozzle is installed on the fixed base; the knife side nozzle component is installed on the fixed base, the knife side nozzle component comprises a nozzle base and a knife side nozzle, the knife side nozzle is installed on the nozzle base and is provided with a blowing pipe section for blowing the blade from the axial side of the blade; and when in use, the knife side nozzle which located on the outside of the blowing pipe section rotates or is installed on the nozzle base through a univ
Bibliography:Application Number: CN201910750193