Phase-change microcapsule with high mechanical property and high heat-conducting property and preparation method thereof

• Main Authors: ZHANG BAOLIAN, FEI XUENING, LIU SIJIA, LOU XUANYE, LI SHANSHAN, CAO LINGYUN
• Format: Patent
• Language: Chinese; English
• Published: 22.11.2019
• Subjects: ADHESIVES; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMISTRY; DYES; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; POLISHES; THEIR RELEVANT APPARATUS; TRANSPORTING

The invention discloses a phase-change microcapsule with high a mechanical property and a high heat-conducting property and a preparation method thereof. A modifier that is silicon carbide is used formodifying melamine resin to obtain a wall material, a phase-change material is used as a core material, and the phase-change microcapsule with the high mechanical property and the high heat-conducting property is prepared by adopting an in-situ polymerization method. Beneficial effects of the microcapsule and the method are that: the wall material modifier that is the nano inorganic filler silicon carbide has excellent heat-conducting and mechanical properties and is relatively low in price; the heat conductivity coefficient of the prepared phase-change microcapsule is 0.1521 W/m*K to 0.1739W/m*K; after the microcapsule is subjected to force tabletting treatment, the melt permeability is only 3%-9.5%, and compared with an unmodified phase change microcapsule, the disclosed phase-change microcapsule has a heat con