Phase-change microcapsule with high mechanical property and high heat-conducting property and preparation method thereof
The invention discloses a phase-change microcapsule with high a mechanical property and a high heat-conducting property and a preparation method thereof. A modifier that is silicon carbide is used formodifying melamine resin to obtain a wall material, a phase-change material is used as a core materi...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
22.11.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a phase-change microcapsule with high a mechanical property and a high heat-conducting property and a preparation method thereof. A modifier that is silicon carbide is used formodifying melamine resin to obtain a wall material, a phase-change material is used as a core material, and the phase-change microcapsule with the high mechanical property and the high heat-conducting property is prepared by adopting an in-situ polymerization method. Beneficial effects of the microcapsule and the method are that: the wall material modifier that is the nano inorganic filler silicon carbide has excellent heat-conducting and mechanical properties and is relatively low in price; the heat conductivity coefficient of the prepared phase-change microcapsule is 0.1521 W/m*K to 0.1739W/m*K; after the microcapsule is subjected to force tabletting treatment, the melt permeability is only 3%-9.5%, and compared with an unmodified phase change microcapsule, the disclosed phase-change microcapsule has a heat con |
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Bibliography: | Application Number: CN201910699361 |