Configurable, encapsulated sensor module and method for making same

A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substratewith a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at leas...

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Bibliographic Details
Main Authors GEOFFROY DAVID JOESPH, RAVELLI MASSIMO EUGENIO, LIGHT DAVID N, BENKLEY III FRED G
Format Patent
LanguageChinese
English
Published 15.11.2019
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
TELEPHONIC COMMUNICATION
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Summary:A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substratewith a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at least part of the PCB are encapsulated in a encapsulating material to produce a structurally robust fingerprint sensor module suitable for integration into an electronics device such as a smartphone or other "Internet of Things" (IOT) electronic device. 一种指纹传感器模块包括附接有电路元件的指纹传感器组件。指纹传感器组件电连接到具有切口以容纳电路元件的印刷电路板(PCB)基板。整个指纹传感器组件和PCB的至少部分被封装在封装材料中以产生适合于集成到诸如智能电话或其他"物联网"(IOT)电子设备的电子设备内的在结构上坚固的指纹传感器模块。
Bibliography:Application Number: CN201880020659