Bonding structure aging prediction method based on chemical characteristic analysis

• Main Authors: NA JINGXIN, MU WENLONG, WANG GUANGBIN, TAN WEI, SHEN HAO, LUAN JIANZE, GAO YUAN, FENG YAO
• Format: Patent
• Language: Chinese; English
• Published: 12.11.2019
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention discloses a bonding structure aging prediction method based on chemical characteristic analysis. The method comprises the steps of S1, producing test pieces; S2, placing the test piecesinto a humid and warm environment box, and carrying out humid and warm cycle according to different temperature or humidity change periods; S3, taking out the test pieces for data testing every otherz periods; and S4, computing approximate correlation of discrete data related to chemical characteristics and mechanical property discrete data in a digital fitting mode, obtaining two groups of correlation degree indexes through combination of a change rule of aging coefficients along with time and the change rule of groups along with the time, and obtaining a mechanical property prediction result. 本发明公开了一种基于化学特性分析的粘结结构老化预测方法，其特征在于，包括：步骤一、制作试验件，其包括：步骤二、将所述试验件放入湿热环境箱内，并按照不同的温度或湿度变化周期进行湿热循环；步骤三、每间隔z个周期，将所述试验件取出进行数据测试；步骤四、采用数字拟合的方式对所述化学特性相关的离散数据和力学性能离散数据的近似相关性进行计算，并结合老化系数随时间的变化规律和基团随时间的变化规律，获得两组相关度指标，从而得到力学性能预测结果。