Pulsed light emitting diode sintering

The disclosure relates to systems and methods for photonic sintering of conductive ink compositions with metal nanoparticles. Specifically, the disclosure relates to methods and systems for sinteringink compositions with metal nanoparticles using an illumination source comprising an array of pulsed...

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Bibliographic Details
Main Author EDLITZ YOCHAI
Format Patent
LanguageChinese
English
Published 08.11.2019
Subjects
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CASTING
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES
NANOTECHNOLOGY
PERFORMING OPERATIONS
POWDER METALLURGY
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
WORKING METALLIC POWDER
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Summary:The disclosure relates to systems and methods for photonic sintering of conductive ink compositions with metal nanoparticles. Specifically, the disclosure relates to methods and systems for sinteringink compositions with metal nanoparticles using an illumination source comprising an array of pulsed light emitting diodes (LEDs). 本公开涉及用于具有金属纳米粒子的导电油墨组合物的光子烧结的系统和方法。具体地说，本公开涉及用于使用包括脉冲发光二极管(LED)阵列的照明源来烧结具有金属纳米粒子的油墨组合物的方法和系统。
Bibliography:Application Number: CN201880019818