SUBSTRATE PROCESSING APPARATUS AND METHOD

• Main Author: KLAVER ARJEN
• Format: Patent
• Language: Chinese; English
• Published: 05.11.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY

A substrate processing apparatus with a reaction chamber and a substrate holder constructed and arranged to hold at least one substrate in said reaction chamber is provided. A first and second gas injector provides a process gas to the interior of the reaction chamber from a source pipe. A gas control system provides a flow of process gas from the source pipe to the first injector while restricting a flow of the same process gas from the source pipe to the second injector. 提供一种衬底处理设备，所述衬底处理设备具有反应室和衬底固持器，所述衬底固持器构造并布置成在所述反应室中固持至少一个衬底。第一和第二气体注射器从源管向所述反应室的内部提供处理气体。气体控制系统实现处理气体从所述源管流到所述第一注射器，同时限制所述同一处理气体从所述源管流到所述第二注射器。