Ultraviolet light-emitting element, ultraviolet light-emitting element packaging body and manufacturing method thereof

• Main Authors: LI SHUIQING, ZANG YASHU, LIN SUHUI, CAI WEILONG, JIANG BIN, PENG KANGWEI
• Format: Patent
• Language: Chinese; English
• Published: 22.10.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An ultraviolet semiconductor light-emitting element includes: a light-transmitting substrate, a semiconductor layer, and an electrode with opposite electrical properties, wherein the semiconductor layer and the electrode with opposite electrical properties are positioned on the first surface side of the light-transmitting substrate. The ultraviolet semiconductor light-emitting element is characterized in that the light-transmitting substrate is provided with a second surface side which is laterally opposite to the first surface and is a light-emitting surface side; the second surface side is divided into a first area on the inner side and a second area on the outer periphery; the first region is patterned or coarsened to be uneven; the second area is a relatively flat area relative to thefirst area; and the thickness of the substrate of the first area is smaller than that of the substrate of the second area or the thickness from the bottom of the uneven morphology of the first area tothe first surface side of