Method for directly electroplating circuit board based on graphene film formation

• Main Authors: ZHOU QIUMAN, SONG WENJIE, PAN ZHANCHANG, WEI ZHIGANG, LIU GEN, HU GUANGHUI
• Format: Patent
• Language: Chinese; English
• Published: 18.10.2019
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention belongs to the technical field of circuit board manufacturing and discloses a method for directly electroplating a circuit board based on graphene film formation. The method comprises steps that a pre-treated circuit board is flushed, and the circuit board is vibrated to fill a hole in the circuit board with the water; the water is removed from the board surface, and the water filledin the hole of the circuit board is reserved; 2, in the film formation process, the circuit board is vibrated, graphene oxide-polymer composite slurry films are formed on the surface of the circuit board and in the hole, and drying, acid pickling, secondary drying and collecting are performed; 3, the circuit board covered with a conductive film is activated by being placed in acidic solution; and4, electroplating solution is prepared, electroplating parameters are set, and electroplating is performed and completed. The method is advantaged in that a conductive layer is formed on the circuitboard to replace chemical c