Method for directly electroplating circuit board based on graphene film formation
The invention belongs to the technical field of circuit board manufacturing and discloses a method for directly electroplating a circuit board based on graphene film formation. The method comprises steps that a pre-treated circuit board is flushed, and the circuit board is vibrated to fill a hole in...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
18.10.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The invention belongs to the technical field of circuit board manufacturing and discloses a method for directly electroplating a circuit board based on graphene film formation. The method comprises steps that a pre-treated circuit board is flushed, and the circuit board is vibrated to fill a hole in the circuit board with the water; the water is removed from the board surface, and the water filledin the hole of the circuit board is reserved; 2, in the film formation process, the circuit board is vibrated, graphene oxide-polymer composite slurry films are formed on the surface of the circuit board and in the hole, and drying, acid pickling, secondary drying and collecting are performed; 3, the circuit board covered with a conductive film is activated by being placed in acidic solution; and4, electroplating solution is prepared, electroplating parameters are set, and electroplating is performed and completed. The method is advantaged in that a conductive layer is formed on the circuitboard to replace chemical c |
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Bibliography: | Application Number: CN201910576948 |