PHOTOSENSITIVE RESIN COMPOSITION, CURED PATTERN PRODUCTION METHOD, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE LAYER, AND ELECTRONIC COMPONENT

• Main Authors: KOIBUCHI YUKARI, SAITO NOBUYUKI, NAMATAME YUTAKA
• Format: Patent
• Language: Chinese; English
• Published: 11.10.2019
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

Provided is a photosensitive resin composition containing component (a), component (b1) and component (b2). (a) a polyimide precursor having structural units represented by formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by formula (11) and a comp...