PHOTOSENSITIVE RESIN COMPOSITION, CURED PATTERN PRODUCTION METHOD, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE LAYER, AND ELECTRONIC COMPONENT

• Main Authors: KOIBUCHI YUKARI, SAITO NOBUYUKI, NAMATAME YUTAKA
• Format: Patent
• Language: Chinese; English
• Published: 11.10.2019
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

Provided is a photosensitive resin composition containing component (a), component (b1) and component (b2). (a) a polyimide precursor having structural units represented by formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by formula (11) and a compound represented by formula (12); (b2) one or more compounds selected from the group consisting of acompound represented by formula (21) and a compound represented by formula (22). 一种感光性树脂组合物，其包含下述(a)成分、(b1)成分和(b2)成分。(a)具有下述式(1)所表示的结构单元的聚酰亚胺前驱体；(b1)选自由下述式(11)所表示的化合物和下述式(12)所表示的化合物组成的组中的一种以上的化合物；(b2)选自由下述式(21)所表示的化合物和下述式(22)所表示的化合物组成的组中的一种以上的化合物。