SEMICONDUCTOR PACKAGE SYSTEM

• Main Authors: JUERSS MICHAEL, MEYER THORSTEN, BEMMERL THOMAS, OTREMBA RALF, ESCHER-POEPPEL IRMGARD, SCHARF THORSTEN, GRUBER MARTIN, SCHLOEGEL XAVER
• Format: Patent
• Language: Chinese; English
• Published: 11.10.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermallyconductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of thesemiconductor package. 一种半导体封装系统包括半导体封装和盖状物。半导体封装包括管芯焊盘，安装或布置到管芯焊盘的第一主面的芯片以及包封芯片和管芯焊盘的包封体。盖状物至少部分地覆盖管芯焊盘的暴露的第二主面。盖状物包括具有电绝缘导热材料的盖状物主体和紧固系统，紧固系统将盖状物紧固到半导体封装上。紧固系统从盖状物主体朝向包封体延伸或沿着半导体封装的侧表面延伸。