Inorganic plasticized microporous heat-insulating board with ultralow water absorption and preparation method thereof

The invention belongs to the technical field of building materials, and particularly discloses an inorganic plasticized microporous heat-insulating board with ultralow water absorption. The inorganicplasticized microporous heat-insulating board is characterized by being composed of, by weight, 40-20...

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Bibliographic Details
Main Authors ZHENG JUANRONG, ZHAO ZHENBO
Format Patent
LanguageChinese
English
Published 11.10.2019
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Summary:The invention belongs to the technical field of building materials, and particularly discloses an inorganic plasticized microporous heat-insulating board with ultralow water absorption. The inorganicplasticized microporous heat-insulating board is characterized by being composed of, by weight, 40-200 parts of cement, 20-100 parts of superfine mineral admixture, 1-30 parts of chemical additive, 40-225 parts of water, 0.4-4 parts of fiber, 1-10 parts of polymer, 0.03-10 parts of foam stabilizer, 1-10 parts of lightweight aggregate and 10-50 parts of foam. Apparent density of the heat-insulatingboard is 80-180kg/m3, compressive strength is 0.3-0.8MPa, tensile strength is higher than 0.10MPa, water absorption per volume is lower than 5.0%, softening coefficient is greater than 0.70, and heatconducting coefficient is 0.038-0.053W/m-K. The heat-insulating board can be used for exterior wall outside heat insulation, roof heat insulation systems and heat insulation and decoration integratedboards. 本发明属于建筑材料技术领域,具体公开了
Bibliography:Application Number: CN201910554003