GUIDED INSPECTION OF SEMICONDUCTOR WAFER BASED ON SPATIAL DENSITY ANALYSIS

Samples at a semiconductor wafer that have been reviewed by a review tool may be identified. Furthermore, a candidate sample at the semiconductor wafer that has not been reviewed by the review tool may be identified. A location of the candidate sample at the semiconductor wafer may and a number of t...

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Bibliographic Details
Main Authors SOFER YOTAM, HIRSZHORN ARIEL
Format Patent
LanguageChinese
English
Published 08.10.2019
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Summary:Samples at a semiconductor wafer that have been reviewed by a review tool may be identified. Furthermore, a candidate sample at the semiconductor wafer that has not been reviewed by the review tool may be identified. A location of the candidate sample at the semiconductor wafer may and a number of the samples that have been reviewed that are at locations proximate to the location of the candidatesample may be determined. The candidate sample may be selected for review by the review tool based on the number of the plurality of samples that are at locations proximate to the location of the candidate sample. 可以识别已经由审查工具审查的半导体晶片处的样本。此外,可以识别未经审查工具审查的半导体晶片处的候选样本。可以确定候选样本在半导体晶片处的位置,并且可以确定在与候选样本的位置邻近的位置处的已被审查的样本的数量。可以基于在与候选样本的位置邻近的位置处的多个样本的数量来选择候选样本以供审查工具审查。
Bibliography:Application Number: CN201910212376