Flame retardant dual-curing adhesive and preparation method thereof

• Main Authors: ZHAI XIQUAN, LIN ZHIXIU, LIN SHAOSHENG
• Format: Patent
• Language: Chinese; English
• Published: 06.09.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The invention discloses a flame retardant dual-curing adhesive. The flame retardant dual-curing adhesive comprises 30-80 wt% of modified acrylate resin, 15-50 wt% of a reactive diluent, 2-7 wt% of a coupling agent, 2-10 wt% of a photoinitiator and 1-3 wt% of asssistants. The flame retardant dual-curing adhesive has excellent adhesion and water resistance, has good flame retardancy, has good compatibility with other resins, has a high bonding strength to different materials, and also has the flame retardancy of extinguishing away from fire; the flame retardant dual-curing adhesive has the advantages of good adhesion to circuit boards, excellent water resistance, excellent flame retardancy, no VOC emission, greenness and environmental protection; and the adhesive has the UV and moisture dual-curing performance, so the adhesive also can be cured without UV irradiation, and is suitable for protecting and sealing the circuit boards. 本发明公开了一种阻燃型双固化胶黏剂，按重量百分比计，包括如下组分：改性丙烯酸酯树脂30-80％、活性稀释剂15-50％、偶联剂2-7％、光引发剂2-10％、助剂1-