METHOD FOR PROCESSING PLATE-SHAPED OBJECT

• Main Author: SHIMOTANI MAKOTO
• Format: Patent
• Language: Chinese; English
• Published: 03.09.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a method for processing a plate-shaped object. When a sheet is eliminated from the plate-shaped object, resin residence on the plate-shaped object is prevented. The method for processing the plate-shaped object comprises the following steps of an external stimulation endowing step, namely endowing an external stimulation to an area (Ta) to be applied with resin (J) of the sheet (T) for improving clinging property of the resin (J); a resin supplying step of supplying the resin (J) to the sheet (T) on which the external stimulation is endowed; and an adhering step, namelyarranging the adhered surface (Wa) of the plate-shaped object (W) in a manner of opposing the sheet (T) with the supplied resin (J), thereby adhering the plate-shaped object (W) to the sheet (T) by means of the resin (J). 提供板状物的加工方法，在将片从板状物去除时，使树脂不会残留在板状物上。该板状物(W)的加工方法具有如下的步骤：外部刺激赋予步骤，对片(T)的至少要粘贴树脂(J)的区域(Ta)赋予外部刺激而提高与树脂(J)的紧贴性；树脂提供步骤，对被赋予了外部刺激的片(T)提供树脂(J)；以及粘贴步骤，使板状物(W)的被粘贴面(Wa)与已被提供了树脂(J)的片(T)对置，借助树脂(J)而将板状物(W)粘贴于片(T)上。