FILM FORMING METHOD AND WINDING TYPE FILM FORMING DEVICE

• Main Authors: HONMA HIROAKI, TAKAHASHI HIROHISA, HASEGAWA MASAKI
• Format: Patent
• Language: Chinese; English
• Published: 23.08.2019
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention provides a film forming method and a winding type film forming device. The film forming method according to an embodiment of the present invention includes a preliminary process in whicha vacuum container is exhausted until the moisture pressure inside the vacuum container reaches a target value or less. Plasma is generated by applying an alternating voltage between a first chrome target and a second chrome target disposed inside the vacuum container. A chrome layer is formed on a film forming surface of a flexible substrate disposed so as to face the first chrome target and thesecond chrome target. The film forming method and the winding type film forming device can suppress deformation of the flexible substrate. 本发明提供成膜方法和卷绕式成膜装置。本发明的一个方式的成膜方法包含预处理，该预处理是对真空容器进行排气直至真空容器内的水分压变成目标值以下的处理。通过向配置在上述真空容器内的第一铬靶与第二铬靶之间施加交流电压而使等离子体产生。在与上述第一铬靶和上述第二铬靶相向配置的挠性基板的成膜面形成铬层。本发明能够抑制挠性基板的变形。